PCB boards are manufactured through a multi-step process that combines specific materials and techniques. Here's a breakdown of the process:
PCB Manufacturing Process Overview
The process begins with the creation of the substrate and the bonding of copper foil to that substrate.
Substrate Creation
- Material Composition: The substrate, which forms the base of the PCB, is made by combining woven glass fiber with epoxy resin. This combination creates a strong and stable base material.
- Thickness and Curing: The mixture is then rolled to the required thickness and semi-cured in an oven. This process partially hardens the material, creating a manageable sheet.
- Panel Cutting: These sheets are then cut into panels, which are the individual building blocks of a larger PCB board.
Copper Foil Layering
- Layer Stacking: These substrate panels are then stacked in alternating layers with adhesive copper foil. This is where the conductive pathways of the board start to take shape.
Here's a simplified table summarizing the initial steps:
| Step | Description |
|---|---|
| Substrate Mix | Glass fibre and epoxy resin are combined. |
| Rolling | The mixture is rolled to the desired thickness. |
| Semi-Curing | The substrate is partially hardened in an oven. |
| Panel Cut | Substrate is cut into individual panels. |
| Layer Stack | Panels are stacked with adhesive copper foil in alternating layers. |
Further Processing
The reference information does not detail the full process beyond this point, but it's important to note that, after these steps, further processes including, image transfer, etching, drilling, and plating take place to create the final finished printed circuit board.
