Wafers, the foundational slices of semiconductor material used to build integrated circuits, are produced through a meticulous process. Based on available information, a key step in their creation involves precisely slicing larger pieces of material called ingots.
The Slicing Process
One crucial stage in wafer manufacturing focuses on transforming a raw semiconductor ingot into usable wafer discs. This process is characterized by precision and careful control.
- Starting Material: The process begins with ingots, which are large, cylindrical pieces of semiconductor material (like silicon or gallium arsenide) grown in a highly controlled environment. These ingots are often described as being shaped like a spinning top.
- Precision Cutting: To create individual wafers, these ingots are sliced into very thin, disc-shaped sections. This cutting is performed using extremely sharp diamond saw blades.
- Uniform Thickness: The slicing process is designed to produce wafers of uniform thickness, which is critical for subsequent manufacturing steps.
- Wafer Size Determination: The diameter of the ingot directly dictates the size of the resulting wafer. Common standard wafer sizes include:
- 150 mm (6 inch) wafers
- 200 mm (8 inch) wafers
- 300 mm (12 inch) wafers
| Stage | Description | Tool Used | Outcome |
|---|---|---|---|
| Starting Form | Ingots, shaped like a spinning top, of varying diameters | N/A | Ready for slicing |
| Slicing | Ingots are cut into thin discs | Sharp diamond saw blades | Thin, disc-shaped wafers of uniform thickness |
This slicing step is just one part of the overall wafer fabrication process, which includes many other stages like polishing, cleaning, and inspection before the wafers are ready for semiconductor device manufacturing.
